EP4CE55F23C6 vs EP4CE55F23C9L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C6 disebabkan oleh Intel dan EP4CE55F23C9L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C6 | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Logic Array Blocks (LABs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Maximum User I/O | 324 | — |
| Embedded 18x18 Multipliers | 343 | 156 |
| General-purpose PLLs | 4 | — |
| Transceiver Clock Inputs | 8 | — |
| Kemasan | 484-FBGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power | — |
| Speed Grade | 6 (commercial) | C9 (fastest commercial/industrial) |
| Suhu Operasi | [DATA_NEEDED: operating temperature] | -40C to +85C (industrial) |
| Supply Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone IV E |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |