EP4CE55F23C6 vs EP4CE55F23C9L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23C6 sa pamamagitan ng Intel at EP4CE55F23C9L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23C6 | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Logic Array Blocks (LABs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Maximum User I/O | 324 | — |
| Embedded 18x18 Multipliers | 343 | 156 |
| General-purpose PLLs | 4 | — |
| Transceiver Clock Inputs | 8 | — |
| Packhaging | 484-FBGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power | — |
| Speed Grade | 6 (commercial) | C9 (fastest commercial/industrial) |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature] | -40C to +85C (industrial) |
| Supply Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone IV E |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |