EP4CE55F29I8L vs EP4CE55F29C8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F29I8L disebabkan oleh Intel dan EP4CE55F29C8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F29I8L | EP4CE55F29C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Device Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 | 156 |
| Maximum User I/Os | 374 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Logic Array Blocks (LABs) | 3,435 | — |
| Process Technology | 60 nm low-power | 60 nm (low-power) |
| Core Voltage VCCINT | 1.0 V / 1.2 V | — |
| Auxiliary Voltage VCCAUX | 2.5 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Kemasan | 780-FBGA (FineLine BGA), 29x29 mm | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40C to +100C junction | — |
| Speed Grade | 8 | C8 (commercial, 8 speed bin) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 55,856 |
| Embedded Memory (M9K Blocks) | — | 260 blocks |
| Maximum User I/O Pins | — | 374 |
| Core Voltage | — | 1.2 V |
| Suhu Operasi | — | 0C to +85C (commercial, 'L' suffix) |
| Configuration Schemes | — | AS, PS, JTAG, FPP |
| JTAG (IEEE 1149.1) | — | Supported |
| Configuration Memory | — | SRAM-based (external flash required) |