EP4CE6E22C6N vs EP4CE6E22C9L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE6E22C6N disebabkan oleh Intel dan EP4CE6E22C9L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE6E22C6N | EP4CE6E22C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Device | EP4CE6 | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Embedded Memory (Bits) | 270 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | — |
| Global Clock Networks | 10 | [DATA_NEEDED: global clock count] |
| Maximum User I/Os | 91 | — |
| I/O Banks | 4 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | — |
| Kemasan | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | 144-LQFP Exposed Pad (EQFP-144) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40 C to +85 C (industrial, C6 speed grade) | 0C to +85C (Commercial) |
| Status RoHS | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Cyclone IV E |
| Logic Elements (LE) | — | 6,272 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Total RAM Bits | — | 276,480 bits |
| Embedded Multipliers (18x18) | — | 15 |
| Maximum User I/O | — | 91 |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Package Dimensions | — | 22 x 22 mm |
| Lead Pitch | — | 0.5 mm |
| Process Node | — | 60 nm |
| Speed Grade | — | C9 |