EP4CE6E22C7 vs EP4CE6E22C6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE6E22C7 disebabkan oleh Intel dan EP4CE6E22C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4CE6E22C7 EP4CE6E22C6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Cyclone IV E —
Family Cyclone IV Cyclone IV E
Core Architecture Logic Elements (LE) —
Number of Logic Elements (LEs) 6,272 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] —
Number of Configurable Logic Blocks (CLBs) 392 —
Total Embedded Memory Bits 276,480 —
Total RAM (Kbits) 270 —
Number of Embedded 18x18 Multipliers 15 —
Number of PLLs 4 —
User I/O Count 91 —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI —
Operating Supply Voltage (Core) 1.0 V to 1.2 V (typ. 1.2 V) —
Operating Supply Voltage (I/O) 1.2 V to 3.3 V —
Logic Speed Grade C7 —
Operating Temperature Range (Commercial) 0°C to +85°C (junction) —
Kemasan 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch —
Jenis Pemasangan Surface Mount Surface Mount
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS) —
Process Technology 60 nm low-power CMOS TSMC 60 nm low-k
Status RoHS Compliant Compliant
Device Logic Elements — 6,272 LE
Logic Array Blocks (LABs) — 392 LABs
Total RAM Bits — 270 Kbit
Embedded 18x18 Multipliers — 15
PLLs — 2
Maximum User I/Os — 91
Core Voltage — 1.2 V
Speed Grade — C6
Suhu Operasi — 0 °C to +85 °C (Commercial)
Package Type — 144-pin EQFP (Enhanced QFP, exposed pad)
Package Dimensions — 22 mm × 22 mm
Lead Pitch — 0.5 mm
Configuration Method — SRAM-based (volatile); JTAG, Active Serial, Passive Serial

Laporan Datasheet & Sumber

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