EP4CGX150DF27I7N vs EP4CGX75DF27I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX150DF27I7N disebabkan oleh Intel dan EP4CGX75DF27I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX150DF27I7N | EP4CGX75DF27I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX150 | Cyclone IV GX |
| Logic Elements (LE) | 149,760 | — |
| Embedded Memory Bits | 6,635,520 bits | — |
| Embedded Memory Blocks | 720 M9K blocks | — |
| User I/O Pins | 393 | — |
| Embedded 18x18 Multipliers | 720 | — |
| Transceivers | 8 (up to 3.125 Gbps) | [DATA_NEEDED: transceiver count and max data rate] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Core Supply Voltage | 1.2 V (typical) | — |
| Suhu Operasi | -40 C to +100 C (industrial, 'I' grade) | -40C to +85C (Industrial) |
| Speed Grade | 7 | — |
| Kemasan | 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch | 672-ball FBGA (F27) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Mode | JTAG / Active Serial / Passive Serial | — |
| Logic Elements | — | 73,920 LE |
| Embedded Memory | — | 4,257,792 bits (4.06 Mbit) |
| Maximum User I/Os | — | 310 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count for EP4CGX75] |
| DSP Blocks / 18x18 Multipliers | — | [DATA_NEEDED: multiplier count] |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Status RoHS | — | Compliant |