EP4CGX22BF14I7N vs EP4CGX22BF14I8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX22BF14I7N disebabkan oleh Intel dan EP4CGX22BF14I8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4CGX22BF14I7N - 22K LE Cyclone IV GX FPGA, 169-LBGA | Intel (Altera)
EP4CGX22BF14I7N ✓ Aktif
Pengandingan Spesifikasi
| Parametr | EP4CGX22BF14I7N | EP4CGX22BF14I8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | 774,144 |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | [DATA_NEEDED: total PLL count] |
| Transceivers | 2 (up to 3.125 Gbps) | Up to 2 channels, 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | -40C to +100C (industrial) |
| Kemasan | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 169-ball FBGA (14 mm x 14 mm) |
| Process Technology | 60 nm | 60 nm |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements | — | 21,280 |
| Embedded Multipliers (18x18) | — | 66 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 8 |
| PCI Express Hard IP | — | Yes |
| User I/O Banks | — | [DATA_NEEDED: bank count and I/O count] |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |