EP4CGX22BF14I7N vs EP4CGX22BF14I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX22BF14I7N sa pamamagitan ng Intel at EP4CGX22BF14I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX22BF14I7N - 22K LE Cyclone IV GX FPGA, 169-LBGA | Intel (Altera)
EP4CGX22BF14I7N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP4CGX22BF14I7N | EP4CGX22BF14I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | 774,144 |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | [DATA_NEEDED: total PLL count] |
| Transceivers | 2 (up to 3.125 Gbps) | Up to 2 channels, 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | -40C to +100C (industrial) |
| Packhaging | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 169-ball FBGA (14 mm x 14 mm) |
| Process Technology | 60 nm | 60 nm |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements | — | 21,280 |
| Embedded Multipliers (18x18) | — | 66 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 8 |
| PCI Express Hard IP | — | Yes |
| User I/O Banks | — | [DATA_NEEDED: bank count and I/O count] |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |