EP4CGX30BF14C6N vs EP4CGX30BF14I6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX30BF14C6N disebabkan oleh Intel dan EP4CGX30BF14I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX30BF14C6N | EP4CGX30BF14I6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 29,440 | — |
| Embedded Memory | 1,105,200 bits | — |
| Number of I/O | 72 | — |
| Kemasan | 169-FBGA (F14) | 169-Ball FBGA (F14) |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Transceivers | 4 channels, up to 3.125 Gbps | — |
| Hardware Multipliers (18x18) | 66 | — |
| PLLs | 4 | 2 |
| Speed Grade | C6 | I6 (industrial) |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 29,440 |
| User I/O Pins | — | 72 (max) |
| Embedded Memory Bits | — | 1,105,920 |
| Transceiver Channels | — | 4 (3.125 Gbps) |
| Operating Temperature (Junction) | — | -40C to +100C |
| Configuration Method | — | SRAM-based, requires external flash |
| DSP Blocks | — | Embedded multipliers (18x18) |
| Hard Memory Controllers | — | DDR/DDR2/QDRII SDRAM |