EP4CGX30BF14C6N vs EP4CGX30BF14I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX30BF14C6N sa pamamagitan ng Intel at EP4CGX30BF14I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX30BF14C6N | EP4CGX30BF14I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 29,440 | — |
| Embedded Memory | 1,105,200 bits | — |
| Number of I/O | 72 | — |
| Packhaging | 169-FBGA (F14) | 169-Ball FBGA (F14) |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Transceivers | 4 channels, up to 3.125 Gbps | — |
| Hardware Multipliers (18x18) | 66 | — |
| PLLs | 4 | 2 |
| Speed Grade | C6 | I6 (industrial) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Logic Elements | — | 29,440 |
| User I/O Pins | — | 72 (max) |
| Embedded Memory Bits | — | 1,105,920 |
| Transceiver Channels | — | 4 (3.125 Gbps) |
| Operating Temperature (Junction) | — | -40C to +100C |
| Configuration Method | — | SRAM-based, requires external flash |
| DSP Blocks | — | Embedded multipliers (18x18) |
| Hard Memory Controllers | — | DDR/DDR2/QDRII SDRAM |