EP4CGX50DF23C7N vs EP4CGX50DF23C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX50DF23C7N disebabkan oleh Intel dan EP4CGX50DF23C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX50DF23C7N | EP4CGX50DF23C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Suhu Operasi | 0 °C to 85 °C (commercial) | — |
| Kemasan | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (DF23) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | JTAG, Passive Serial, Active Serial |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| Status RoHS | Compliant (Pb-free variant) | Compliant |
| Aras MSL | 3 (168 hours) | 3 (168 hours) |
| Core Supply Voltage | — | 1.2 V |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Commercial (0C to +85C) |