EP4CGX50DF23C7N vs EP4CGX50DF23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF23C7N sa pamamagitan ng Intel at EP4CGX50DF23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF23C8N - 49,888 Cells Cyclone IV GX FPGA, 484-FBGA | Intel
EP4CGX50DF23C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF23C7N | EP4CGX50DF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | — |
| Packhaging | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (DF23) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | JTAG, Passive Serial, Active Serial |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| Tindminan RoHS | Compliant (Pb-free variant) | Compliant |
| Level ng MSL | 3 (168 hours) | 3 (168 hours) |
| Core Supply Voltage | — | 1.2 V |
| Ball Pitch | — | 1.00 mm |
| Seated Height | — | 2.40 mm |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Commercial (0C to +85C) |