EP4SGX110DF29C3G vs EP4SGX110DF29I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110DF29C3G disebabkan oleh Intel dan EP4SGX110DF29I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX110DF29C3G | EP4SGX110DF29I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | — |
| User I/O Count | 372 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Package Pin/Ball Count | 780 | — |
| Tegangan Pemberi Arus | 0.9 V core | — |
| Process Technology | 40 nm | 40 nm |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | 660 (18x18 multipliers) |
| Suhu Operasi | Commercial (0C to +85C) - per C3 grade suffix | -40C to +100C (Industrial I3 grade) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 105,600 |
| Adaptive Logic Modules (ALM) | — | 41,250 |
| Embedded Memory Bits | — | 9,793,536 |
| Embedded Memory Blocks (M9K) | — | 660 |
| Maximum User I/O | — | 372 |
| Transceivers | — | 16 (up to 8.5 Gbps) |
| PCIe Hard IP | — | Gen2 x4 (8.5 Gbps) |
| Kemasan | — | 780-ball FCBGA, 29x29 mm |
| Package Code | — | DF29 |
| Speed Grade | — | 3 |
| Aras MSL | — | [DATA_NEEDED: MSL level] |