EP4SGX230HF35I4G vs EP4SGX70HF35C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX230HF35I4G disebabkan oleh Intel dan EP4SGX70HF35C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX230HF35I4G | EP4SGX70HF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix IV GX | — |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Kemasan | 1152-ball FCBGA (HF35) | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | Stratix IV GX |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Speed Grade | — | HF35 |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |