EP4SGX360HF35I3 vs EP4SGX360HF35C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360HF35I3 disebabkan oleh Intel dan EP4SGX360HF35C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360HF35I3 | EP4SGX360HF35C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX Field Programmable Gate Array | Stratix IV GX FPGA |
| Logic Elements (LEs) | 353,600 | 353,600 |
| Total LABs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| User I/Os | 564 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | 0C to +85C (commercial) |
| Package Type | 1152-Ball FCBGA (FineLine BGA) | 1152-pin FC-FBGA |
| Speed Grade | F35 | — |
| Process Technology | 40 nm | 40 nm |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, HSTL, SSTL | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| DSP Blocks | Yes (hard DSP blocks) | — |
| Status RoHS | Compliant | Compliant |
| Configuration Modes | Serial, Parallel, JTAG, Active Serial | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Number of Logic Cells | — | 353,600 |
| Transceivers | — | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |