EP4SGX530HH35C4 vs EP4SGX530HH35I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35C4 disebabkan oleh Intel dan EP4SGX530HH35I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35C4 | EP4SGX530HH35I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | — |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Kemasan | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm |
| Speed Grade | HH35 | I4 |
| Suhu Operasi | 0 C to 85 C (Commercial, -C4 suffix) | 0C to 85C (Industrial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | — |
| DSP Blocks | [DATA_NEEDED: block count for this density] | — |
| PLLs | 8 fractional PLLs | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount |
| Aras MSL | MSL3 (per BGA package standard) | — |
| Status RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 21,248 |
| Maximum User I/O | — | 564 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate | — | 600 Mbps to 8.5 Gbps |
| Maximum Internal Frequency | — | 800 MHz |
| Embedded 18x18 Multipliers | — | 1,040 |
| PLL Count | — | 4 |
| Global Clock Networks | — | 16 |
| Ball Pitch | — | 1.0 mm |
| Process Node | — | 40 nm TSMC |
| PCI Express Hard IP | — | Gen1/Gen2 x1/x4/x8 |