EP4SGX530HH35I4 vs EP4SGX530HH35C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35I4 disebabkan oleh Intel dan EP4SGX530HH35C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35I4 | EP4SGX530HH35C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Logic Array Blocks (LABs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O | 564 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps | — |
| Maximum Internal Frequency | 800 MHz | — |
| Embedded 18x18 Multipliers | 1,040 | — |
| PLL Count | 4 | — |
| Global Clock Networks | 16 | — |
| Kemasan | 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | 0C to 85C (Industrial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | I4 | HH35 |
| Process Node | 40 nm TSMC | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Maximum User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Transceivers | — | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | — | [DATA_NEEDED: block count for this density] |
| PLLs | — | 8 fractional PLLs |
| Aras MSL | — | MSL3 (per BGA package standard) |