EP4SGX70DF29C4N vs EP4SGX70DF29C2XG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29C4N disebabkan oleh Intel dan EP4SGX70DF29C2XG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX70DF29C4N | EP4SGX70DF29C2XG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 72,600 | — |
| Adaptive Logic Modules (ALMs) | 2,904 | — |
| Logic Array Blocks (CLBs) | 2,904 | — |
| Maximum User I/O | 372 | 372 |
| Total Embedded Memory | 4,134 Kbit (5,648,880 bit) | — |
| Number of Logic Cells | 72,600 | — |
| DSP Blocks | 462 | — |
| DSP Multiplier Modes | 9x9, 12x12, 18x18, 36x36 bit | — |
| DSP Block Max Frequency | 600 MHz | — |
| Transceivers | 8 channels (GX) | — |
| Max Transceiver Data Rate | 3.125 Gbps | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 | — |
| Kemasan | 780-ball FC-FBGA (29 x 29 mm) | 780-FBGA (29x29 mm) |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| Status RoHS | Compliant | Compliant |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Configuration Security | Built-in AES encryption and CRC | — |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory | — | 7,564,880 bits |
| Process Technology | — | 40 nm |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| Gambaran Suhu Operasi | — | -40C to +85C (commercial) |
| Aras MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |