EPF10K200EBI600-2 vs EPF10K200EBC600-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EBI600-2 disebabkan oleh Intel dan EPF10K200EBC600-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoletePengandingan Spesifikasi
| Parametr | EPF10K200EBI600-2 | EPF10K200EBC600-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | 200,000 |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | — |
| Suhu Operasi | 0 C to 70 C (commercial) | 0C to +70C (commercial) |
| Kemasan | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball FineLine BGA, 45 x 45 mm |
| Logic Family | CMOS, SRAM-based | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | — |
| Status RoHS | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Series | — | FLEX-10KE |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Maximum User I/O | — | 470 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | — | 0.22 micrometer SRAM |
| Speed Grade | — | -3 (commercial) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |