EPF10K200EBI600-2 vs EPF10K200EBC600-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBI600-2 sa pamamagitan ng Intel at EPF10K200EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBI600-2 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | 200,000 |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | — |
| Temperature na Operasyon | 0 C to 70 C (commercial) | 0C to +70C (commercial) |
| Packhaging | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball FineLine BGA, 45 x 45 mm |
| Logic Family | CMOS, SRAM-based | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | — |
| Tindminan RoHS | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Series | — | FLEX-10KE |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Maximum User I/O | — | 470 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | — | 0.22 micrometer SRAM |
| Speed Grade | — | -3 (commercial) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |