EPF10K250EFI672-3 vs EPF10K250EFC672-2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K250EFI672-3 disebabkan oleh Intel dan EPF10K250EFC672-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPF10K250EFI672-3 | EPF10K250EFC672-2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | 250,000 |
| Logic Elements | [DATA_NEEDED: exact LE count] | 12,480 |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | 20 |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | 2.3 V (typical 2.5 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Kemasan | 672-ball FineLine BGA, 1.27 mm pitch | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Process Technology | CMOS, SRAM-based configuration | — |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | — |
| Suhu Operasi | 0 °C to 70 °C (commercial) | 0 C to +70 C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| Status RoHS | Unknown (legacy Altera non-RoHS device) | Non-RoHS Compliant (per Fly-Wing listing) |
| Maximum User RAM Bits | — | 40,960 |
| User I/Os | — | 470 |
| Kiraan Pin | — | 672 |
| Propagation Delay | — | 0.4 ns |
| I/O Standard Support | — | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Logic Family | — | CMOS, SRAM-based |
| Configuration | — | SRAM, in-system programmable (ISP) via JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) compliant |
| Jenis Pemasangan | — | Surface Mount |