EPF10K250EFI672-3 vs EPF10K250EFC672-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFI672-3 sa pamamagitan ng Intel at EPF10K250EFC672-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EFI672-3 | EPF10K250EFC672-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | 250,000 |
| Logic Elements | [DATA_NEEDED: exact LE count] | 12,480 |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | 20 |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | 2.3 V (typical 2.5 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | — |
| Packhaging | 672-ball FineLine BGA, 1.27 mm pitch | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Process Technology | CMOS, SRAM-based configuration | — |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | — |
| Temperature na Operasyon | 0 °C to 70 °C (commercial) | 0 C to +70 C (Commercial) |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| Tindminan RoHS | Unknown (legacy Altera non-RoHS device) | Non-RoHS Compliant (per Fly-Wing listing) |
| Maximum User RAM Bits | — | 40,960 |
| User I/Os | — | 470 |
| Bilang ng Pin | — | 672 |
| Propagation Delay | — | 0.4 ns |
| I/O Standard Support | — | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Logic Family | — | CMOS, SRAM-based |
| Configuration | — | SRAM, in-system programmable (ISP) via JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) compliant |
| Uri ng Pagpapasok | — | Surface Mount |