EPF10K30EFC256-3N vs EPF10K50EFC256-3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K30EFC256-3N disebabkan oleh Intel dan EPF10K50EFC256-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPF10K50EFC256-3 - 50K Gates FLEX 10KE FPGA, 256-BGA | Intel / Altera
EPF10K50EFC256-3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPF10K30EFC256-3N | EPF10K50EFC256-3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 1,728 | 2880 |
| Gate Count | 30,000 gates | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Embedded RAM | 24,576 bits | — |
| Maximum User I/Os | 176 | 191 |
| Kemasan | 256-pin FineLine BGA (FBGA) | 256-pin FineLine BGA (FBGA-256) |
| Core Voltage | 2.5 V | — |
| I/O Standard Support | MultiVolt 2.5 V / 3.3 V / 5.0 V | — |
| Internal Frequency | 80 MHz (typical) | — |
| Propagation Delay (tPD) | 0.6 ns | — |
| Bidirectional I/O Performance | up to 212 MHz | — |
| PCI Compliance | PCI SIG 2.2 at 33 / 66 MHz | — |
| Process Technology | 0.22 um CMOS | 0.42 µm CMOS, SRAM-based |
| Suhu Operasi | 0 C to +70 C (Commercial) | 0 °C to +70 °C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | IEEE Std. 1149.1 Boundary-Scan |
| Open-Drain I/O Option | Yes (per pin) | — |
| Typical Gates | — | 50,000 |
| Total Embedded Memory | — | 40,960 bits |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Tolerance | — | 5.0 V (MultiVolt I/O interface) |
| Internal Frequency (max) | — | 166.67 MHz |
| Propagation Delay (typical) | — | 0.6 ns |
| Speed Grade | — | -3 |
| Programming Method | — | In-system SRAM, JTAG or EPC configuration device |
| Status RoHS | — | Compliant |