EPF10K30EFC256-3N vs EPF10K50EFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-3N sa pamamagitan ng Intel at EPF10K50EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K50EFC256-3 - 50K Gates FLEX 10KE FPGA, 256-BGA | Intel / Altera
EPF10K50EFC256-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-3N | EPF10K50EFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 1,728 | 2880 |
| Gate Count | 30,000 gates | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Embedded RAM | 24,576 bits | — |
| Maximum User I/Os | 176 | 191 |
| Packhaging | 256-pin FineLine BGA (FBGA) | 256-pin FineLine BGA (FBGA-256) |
| Core Voltage | 2.5 V | — |
| I/O Standard Support | MultiVolt 2.5 V / 3.3 V / 5.0 V | — |
| Internal Frequency | 80 MHz (typical) | — |
| Propagation Delay (tPD) | 0.6 ns | — |
| Bidirectional I/O Performance | up to 212 MHz | — |
| PCI Compliance | PCI SIG 2.2 at 33 / 66 MHz | — |
| Process Technology | 0.22 um CMOS | 0.42 µm CMOS, SRAM-based |
| Temperature na Operasyon | 0 C to +70 C (Commercial) | 0 °C to +70 °C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | IEEE Std. 1149.1 Boundary-Scan |
| Open-Drain I/O Option | Yes (per pin) | — |
| Typical Gates | — | 50,000 |
| Total Embedded Memory | — | 40,960 bits |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Tolerance | — | 5.0 V (MultiVolt I/O interface) |
| Internal Frequency (max) | — | 166.67 MHz |
| Propagation Delay (typical) | — | 0.6 ns |
| Speed Grade | — | -3 |
| Programming Method | — | In-system SRAM, JTAG or EPC configuration device |
| Tindminan RoHS | — | Compliant |