EPM570F256C3N vs EPM570F256C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C3N disebabkan oleh Intel dan EPM570F256C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C3N | EPM570F256C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm 6-layer-metal flash |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | 160 |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Macrocells | — | 440 |
| Logic Array Blocks (LABs) | — | 57 |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Gambaran Suhu Operasi | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |