EPM570ZM256I8N vs EPM570ZM256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570ZM256I8N disebabkan oleh Intel dan EPM570ZM256C6N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570ZM256I8N | EPM570ZM256C6N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | MAX II |
| Family | MAX II Z (zero-power, 1.8 V core) | — |
| Macro Cells | 440 | — |
| Logic Elements | 570 | — |
| Maximum Internal Frequency | 118.3 MHz | — |
| Process Technology | 0.18 micrometer, 6-layer-metal flash | 0.18 micron CMOS, 6-layer-metal flash |
| User Flash Memory | 8 Kbit | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 | — |
| Macrocells per LAB | 16 | — |
| Number of Global Clocks | 4 | — |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| MultiVolt I/O Bank Supply | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programmable Type | In System Programmable (ISP) via JTAG | In System Programmable (Flash, non-volatile) |
| User I/O Pins (max) | 212 | — |
| Propagation Delay (tPD1) | 9.9 ns | — |
| Kemasan | 256-MBGA (Micro FBGA), 11 mm x 11 mm | 256-MBGA (FineLine BGA) 11x11 mm |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | -40 C to +100 C (Industrial) | 0C to +85C (commercial) |
| Status RoHS | Compliant | Lead-free (per Heisener listing) |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Pin/Pitch | — | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | — | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | — | 9 ns (per Heisener listing for Z speed grade) |