EPM570ZM256I8N vs EPM570ZM256C6N 比較
詳細並排比較 EPM570ZM256I8N 由 Intel 與 EPM570ZM256C6N 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM570ZM256I8N | EPM570ZM256C6N |
|---|---|---|
| 品牌 | Intel | Altera |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | MAX II | MAX II |
| Family | MAX II Z (zero-power, 1.8 V core) | — |
| Macro Cells | 440 | — |
| Logic Elements | 570 | — |
| Maximum Internal Frequency | 118.3 MHz | — |
| Process Technology | 0.18 micrometer, 6-layer-metal flash | 0.18 micron CMOS, 6-layer-metal flash |
| User Flash Memory | 8 Kbit | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 | — |
| Macrocells per LAB | 16 | — |
| Number of Global Clocks | 4 | — |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| MultiVolt I/O Bank Supply | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programmable Type | In System Programmable (ISP) via JTAG | In System Programmable (Flash, non-volatile) |
| User I/O Pins (max) | 212 | — |
| Propagation Delay (tPD1) | 9.9 ns | — |
| 封裝 | 256-MBGA (Micro FBGA), 11 mm x 11 mm | 256-MBGA (FineLine BGA) 11x11 mm |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 工作溫度 | -40 C to +100 C (Industrial) | 0C to +85C (commercial) |
| RoHS 狀態 | Compliant | Lead-free (per Heisener listing) |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Pin/Pitch | — | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | — | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | — | 9 ns (per Heisener listing for Z speed grade) |