IQE013N04LM6SCATMA1 vs IQE013N04LM6ATMA1 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci IQE013N04LM6SCATMA1 disebabkan oleh Infineon dan IQE013N04LM6ATMA1 disebabkan oleh Infineon. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr IQE013N04LM6SCATMA1 IQE013N04LM6ATMA1
Merek Infineon Infineon
Kategori MOSFETs MOSFETs
Status Lingkungan Hidup Aktif Aktif
FET Type N-Channel —
Technology OptiMOS (trench MOSFET) OptiMOS N-channel trench MOSFET
Drain-Source Voltage (V<sub>DS</sub>) 40 V —
Gate-Source Voltage (V<sub>GS</sub>) ±20 V —
R<sub>DS(on)</sub> max @ V<sub>GS</sub>=10 V 1.35 mΩ —
Continuous Drain Current (I<sub>D</sub>) at T<sub>A</sub>=25 °C 31 A —
Continuous Drain Current (I<sub>D</sub>) at T<sub>C</sub>=25 °C [DATA_NEEDED: I_D at T_C] (per distributor listing 205 A pulsed) —
Pulsed Drain Current (I<sub>DM</sub>) at T<sub>C</sub>=25 °C 205 A —
Power Dissipation (P<sub>D</sub>) at T<sub>A</sub>=25 °C 2.5 W —
Power Dissipation (P<sub>D</sub>) at T<sub>C</sub>=25 °C 107 W —
Total Gate Charge (Q<sub>G</sub>) @ V<sub>GS</sub>=10 V 41 nC —
Output Capacitance (C<sub>oss</sub>) @ V<sub>DS</sub>=20 V 3800 pF —
Kemasan PG-WHSON-8-1 (3.3 mm × 3.3 mm Source-Down PQFN) with exposed pad PG-TSON-8-4 / PQFN 3.3x3.3 mm Source-Down
Jenis Pemasangan Surface Mount Surface Mount
Gambaran Suhu Operasi [DATA_NEEDED: T_J min/max] -55 °C to +175 °C
Status RoHS Compliant Compliant
Packaging Tape & Reel —
Part Family OptiMOS Source-Down, 40 V, 3.3×3.3 PQFN —
Polarity — N-Channel
Drain-Source Voltage (VDS) — 40 V
Gate-Source Voltage (VGS) — ±20 V
Continuous Drain Current (Ta) — 31 A
Continuous Drain Current (Tc) — 205 A
Power Dissipation (Ta) — 2.5 W
Power Dissipation (Tc) — 107 W
On-Resistance RDS(on) max — [DATA_NEEDED: RDS(on) max value at VGS=10V]
On-Resistance RDS(on) typ — 1.35 mΩ @ VGS=10 V, ID=20 A
Gate Threshold Voltage (VGS(th)) — 2 V (typ)
Source-Down Topology — Yes (flip-chip die attach, drain on top thermal pad)

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