K9HQGY8S5M vs K9CHGY8S5C-CCK0 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci K9HQGY8S5M disebabkan oleh Samsung Electronics dan K9CHGY8S5C-CCK0 disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ Aktif
Samsung Electronics
K9CHGY8S5C-CCK0 K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 ✓ Aktif

Pengandingan Spesifikasi

Parametr K9HQGY8S5M K9CHGY8S5C-CCK0
Merek Samsung Electronics Samsung Electronics
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Manufacturer Samsung Electronics Samsung Electronics
Product Type 3D V-NAND Flash Memory (stacked, client NAND) NAND Flash Memory
Package Type 316-ball Fine Pitch BGA (FBGA-316) —
Die Configuration 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis) —
NAND Technology 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis) —
Memory Class Non-volatile NAND flash —
Antaramuka NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode] —
Density [DATA_NEEDED: total bit density] [DATA_NEEDED: total density in Gb]
Tegangan Pemberi Arus [DATA_NEEDED: VCC range] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] —
Program/Erase Cycles [DATA_NEEDED: P/E endurance rating] [DATA_NEEDED: P/E endurance]
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA reflow)
Suhu Operasi [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Original Application Samsung SSD 850 Pro solid-state drive —
Kemasan — BGA-316
Organisasi — x8 (8-bit data access), quad CE configuration
Chip Enable Count — 16 (CE_n)
Pin Reduction — Not used
Supply Rail VCC — 1.83 V
Supply Rail (secondary) — 1.84 V
Supply Rail VCCQ-class — 2.96 V
Program/Erase Supply Rail — 12 V domain
Memory Technology — [DATA_NEEDED: cell type / V-NAND generation]
Jenis Antaramuka — [DATA_NEEDED: toggle DDR / ONFI, max data rate]

Laporan Datasheet & Sumber

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