LPC5526JBD64E vs LPC5526JBD64K Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci LPC5526JBD64E disebabkan oleh NXP Semiconductors dan LPC5526JBD64K disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | LPC5526JBD64E | LPC5526JBD64K |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-Bit |
| Frekuensi Klock Maksimum | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | 256 KB (256K x 8) |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | — |
| Interrupt Controller | NVIC (built-in) | NVIC (Nested Vectored Interrupt Controller) |
| NMI Input | Yes, with selection of sources | Yes, with selectable sources |
| Process Technology | 40 nm NVM | 40-nm NVM |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | 3.3 V |
| Suhu Operasi | [DATA_NEEDED: temperature range] | — |
| Kemasan | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) with exposed pad |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Tingkat sensitiviti Air Nama (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | — |
| Status RoHS | Compliant | — |
| Status Lingkungan Hidup | Active | Active |
| SRAM | — | [DATA_NEEDED: SRAM size] |
| Packaging | — | Tray |
| Memory Protection Unit (MPU) | — | Yes |
| Serial Interfaces | — | FlexComm (UART/SPI/I2C), USB HS, SDIO (family features) |
| ADC | — | 16-bit, 1.0 Msamples/sec (family feature) |
| Timer/Counter | — | 32-bit counter/timers, SCTimer/PWM (family feature) |
| Logic Expansion | — | Programmable Logic Unit (PLU) (family feature) |