M1AFS1500-1FG256K vs M1AFS1500-1FGG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS1500-1FG256K disebabkan oleh Microchip Technology dan M1AFS1500-1FGG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
M1AFS1500-1FG256K ✓ AktifMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS1500-1FG256K | M1AFS1500-1FGG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Microchip Technology | — |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 1500000 | 1,500,000 |
| Logic Cells | 38400 | 38,400 |
| Number of I/O | 119 | — |
| Flash Memory | 276480 bits | — |
| Processor Core | ARM Cortex-M1 (soft core) | — |
| Speed Grade | -1 | -1 |
| Kemasan | 256-LBGA (FG256) | — |
| Jenis Pemasangan | Surface Mount | — |
| Configuration Technology | Flash (instant-on, single-chip) | — |
| Analog Features | Configurable analog blocks (Fusion mixed-signal) | — |
| Programmability | In-System Programmable | — |
| Status RoHS | RoHS Non-Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free Status | Contains Lead | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| Embedded Memory Blocks | [DATA_NEEDED: SRAM block size] | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | Fusion (M1AFS1500) |
| Embedded Processor | — | ARM Cortex-M1 |
| Frekuensi Klock Maksimum | — | 350 MHz |
| Number of I/Os | — | 119 |
| Tegangan Pemberi Arus | — | 1.5 V |
| Technology | — | CMOS, 130 nm |
| Configuration Memory | — | Flash-based (non-volatile) |
| Kemasan / Case | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Gaya Pemasangan | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |
| Clock Management | — | Integrated clock generation and management circuitry |