M1AFS250-1FGG256I vs M1AFS250-FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS250-1FGG256I disebabkan oleh Microchip Technology dan M1AFS250-FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ AktifMicrochip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS250-1FGG256I | M1AFS250-FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | M1AFS250 (Fusion) | Fusion (M1AFS) |
| System Gates | 250,000 gates | 250K |
| Logic Cells | 6144 | — |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | — |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | — |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | — |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | On-chip flash (non-volatile) |
| Security | 128-bit flash-based lock, AES decryption | — |
| Tegangan Pemberi Arus Operasi | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Kemasan / Case | 256-LBGA (FBGA), 1.00 mm ball pitch | — |
| Gaya Pemasangan | SMD/SMT | — |
| Packaging | Tray | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| D Flip-Flops / Registers | — | 36864 |
| User I/O | — | 114 |
| Embedded Processor | — | ARM Cortex-M1 |
| Core Supply Voltage | — | 1.5 V |
| Fabric Speed Metric | — | 1.0989 GHz (per distributor listing) |
| Process Technology | — | 130 nm flash-based |
| Kemasan | — | 256-LBGA (FGG256) |
| Ball Pitch | — | 1.0 mm |
| Jenis Pemasangan | — | Surface Mount |
| Suhu Operasi | — | -40C to +85C (Industrial) |