M1AFS250-1FGG256I vs M1AFS250-FGG256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology at M1AFS250-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Nakahanda
Microchip Technology
M1AFS250-FGG256I M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip

M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip

M1AFS250-FGG256I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M1AFS250-1FGG256I M1AFS250-FGG256I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series M1AFS250 (Fusion) Fusion (M1AFS)
System Gates 250,000 gates 250K
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) —
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) On-chip flash (non-volatile)
Security 128-bit flash-based lock, AES decryption —
Supply Voltage na Operasyon 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packhaging / Kaso 256-LBGA (FBGA), 1.00 mm ball pitch —
Style ng Pagpapasok SMD/SMT —
Packaging Tray Tray
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
D Flip-Flops / Registers — 36864
User I/O — 114
Embedded Processor — ARM Cortex-M1
Core Supply Voltage — 1.5 V
Fabric Speed Metric — 1.0989 GHz (per distributor listing)
Process Technology — 130 nm flash-based
Packhaging — 256-LBGA (FGG256)
Ball Pitch — 1.0 mm
Uri ng Pagpapasok — Surface Mount
Temperature na Operasyon — -40C to +85C (Industrial)

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