M7AFS600-2FGG256I vs M7AFS600-1FGG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-2FGG256I disebabkan oleh Microchip Technology dan M7AFS600-1FGG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ AktifMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktifPengandingan Spesifikasi
| Parametr | M7AFS600-2FGG256I | M7AFS600-1FGG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600000 | 600K |
| User I/O | 119 | — |
| Flash Memory Blocks | 110592 bits | — |
| Processor Support | ARM CoreMP7 | — |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | 350 MHz | Up to 350 MHz |
| Tegangan Pemberi Arus | 1.5 V (core) | — |
| Logic Family | CMOS | — |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) | — |
| Kemasan | 256-LBGA (FBGA-256), 1.0 mm ball pitch | — |
| Number of Pins/Balls | 256 | — |
| Suhu Operasi | 0 to 70 C | — |
| Speed Grade | -2 | -1 |
| Jenis Pemasangan | Surface Mount | — |
| Packaging | Tray | Tray |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Tegangan Pemberi Arus Operasi | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Kemasan / Case | — | 256-Ball FBGA (FGG256) |
| Gaya Pemasangan | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |