M7AFS600-2FGG256I vs M7AFS600-1FGG256I 比較
詳細並排比較 M7AFS600-2FGG256I 由 Microchip Technology 與 M7AFS600-1FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ 啟用中Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 啟用中規格比較
| 參數 | M7AFS600-2FGG256I | M7AFS600-1FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600000 | 600K |
| User I/O | 119 | — |
| Flash Memory Blocks | 110592 bits | — |
| Processor Support | ARM CoreMP7 | — |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | 350 MHz | Up to 350 MHz |
| 供應電壓 | 1.5 V (core) | — |
| Logic Family | CMOS | — |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) | — |
| 封裝 | 256-LBGA (FBGA-256), 1.0 mm ball pitch | — |
| Number of Pins/Balls | 256 | — |
| 工作溫度 | 0 to 70 C | — |
| Speed Grade | -2 | -1 |
| 安裝類型 | Surface Mount | — |
| Packaging | Tray | Tray |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| 工作電源電壓 | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| 封裝 / 外殼 | — | 256-Ball FBGA (FGG256) |
| 安裝方式 | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |