MC908JL8CPE vs MC908JL3ECPE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC908JL8CPE disebabkan oleh NXP Semiconductors dan MC908JL3ECPE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC908JL8CPE | MC908JL3ECPE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MC908JL8CPE | — |
| Core Architecture | HC08 (M68HC08 family), CISC 8-bit | — |
| Sub-Family | HC08JL | — |
| Maximum Bus Clock | 8 MHz | — |
| Program Memory | 8 KB Flash (8K x 8) | — |
| Data Memory (RAM) | 128 bytes | — |
| Data EEPROM | [DATA_NEEDED: EEPROM size if any] | — |
| On-Chip ADC | 8-bit, up to 8 input channels, successive-approximation | — |
| Timer Modules | 1 x 16-bit timer with PWM capability | — |
| Serial Interface | SCI (Serial Communications Interface) | — |
| I/O Pins | [DATA_NEEDED: number of general-purpose I/O pins] | — |
| Supply Voltage (VDD) | 3.0 V to 5.5 V | — |
| Suhu Operasi | -40 C to +85 C (industrial) | — |
| Kemasan | 28-pin PDIP (Plastic Dual In-line Package), through-hole | 28-pin PDIP (Through-Hole) |
| Package Code | DIP-28 | — |
| Jenis Pemasangan | Through-Hole (THT) | Through-Hole |
| Aras MSL | 1 (unlimited) | Not applicable (through-hole) |
| Status RoHS | Compliant per distributor listings | See manufacturer documentation |
| Core | — | HC08 (M68HC08 Family) |
| Lebar Bus Data | — | 8 bit |
| Frekuensi Klock Maksimum | — | 8 MHz |
| Program Memory Size | — | 4 KB FLASH |
| RAM Size | — | 128 bytes |
| ADC | — | 8-channel, 10-bit |
| Supply Voltage Range | — | 3 V to 5.5 V |
| Gambaran Suhu Operasi | — | -40C to +85C |
| Number of I/O Pins | — | 23 |
| Timers | — | 1 x 16-bit (TPM, 2 channels) |
| Communication Interface | — | Enhanced SCI (ESCI) |
| On-Chip Debug | — | Background Debug Module (BDM) |