MC9S08AC60CFDE vs MC9S08AW60MFDE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AC60CFDE disebabkan oleh NXP Semiconductors dan MC9S08AW60MFDE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S08AC60CFDE MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE - 8-bit S08 MCU 60KB Flash 40MHz QFN-48 | NXP

MC9S08AC60CFDE Nrnd
NXP Semiconductors
MC9S08AW60MFDE MC9S08AW60MFDE - 8-bit HCS08 MCU 60KB Flash 40MHz | NXP

MC9S08AW60MFDE - 8-bit HCS08 MCU 60KB Flash 40MHz | NXP

MC9S08AW60MFDE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S08AC60CFDE MC9S08AW60MFDE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core Processor S08 (HCS08), 8-bit CISC —
Core Size 8-bit —
CPU Clock Speed 40 MHz —
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
Supply Voltage Range 2.7 V to 5.5 V —
Tegangan Pemberi Arus Operasi 3.3 V / 5 V —
Number of I/O 38 —
ADC Resolution 10-bit —
ADC Channels Up to 16-channel with automatic compare function —
Communication Interfaces 2x SCI (LIN 2.0, SAE J2602), SPI, IIC —
Peripherals ADC, SCI, SPI, IIC —
Kemasan 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch)
Jenis Pemasangan Surface Mount Surface Mount
Family Compatibility Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) —
Status Lingkungan Hidup NRND (per NXP product page) —
Status RoHS ROHS COMPLIANT (per distributor datasheet listing) Compliant
Packaging Tray —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Core Architecture — HCS08 (8-bit CISC, enhanced HC08)
CPU Speed — 40 MHz (20 MHz internal bus)
Program Memory — 60 KB Flash
RAM — 2 KB
Tegangan Pemberi Arus — 2.7 V to 5.5 V
I/O Ports — 38
Suhu Operasi — -40C to +85C (industrial)
ROM Type — Flash (in-application programmable)
Debug Interface — Single-wire BDM (background debug mode)
ADC — Up to 16-channel 10-bit
Timers — Multiple 16-bit timer/PWM channels
Communication — SCI (UART), SPI, I2C

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