MC9S08DN60MLF vs MC9S08AW60CFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DN60MLF disebabkan oleh NXP Semiconductors dan MC9S08AW60CFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Pengandingan Spesifikasi
| Parametr | MC9S08DN60MLF | MC9S08AW60CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | [DATA NEEDED: Lifecycle Status] | NRND |
| Product Type | 8-bit HCS08 embedded microcontroller | 8-bit HCS08 microcontroller |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Kemasan | 48-LQFP (7x7 mm) | 64-QFP, 14 x 14 mm |
| Jenis Pemasangan | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | — |
| Packaging | Tray | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Tegangan Pemberi Arus | — | 2.7 V to 5.5 V |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Gaya Pemasangan | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Status Lingkungan Hidup | — | NRND |
| Supplier Reference | — | NXP USA Inc. |