MC9S12DG256BVPV vs MC9S12DG256BCPV Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DG256BVPV disebabkan oleh NXP Semiconductors dan MC9S12DG256BCPV disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12DG256BVPV MC9S12DG256BVPV - 16-bit 25MHz HCS12 MCU 256KB Flash | NXP

MC9S12DG256BVPV - 16-bit 25MHz HCS12 MCU 256KB Flash | NXP

MC9S12DG256BVPV ✓ Aktif
NXP Semiconductors
MC9S12DG256BCPV MC9S12DG256BCPV - 16-Bit HCS12 MCU, 256KB Flash | NXP

MC9S12DG256BCPV - 16-Bit HCS12 MCU, 256KB Flash | NXP

MC9S12DG256BCPV Obsolete

Pengandingan Spesifikasi

Parametr MC9S12DG256BVPV MC9S12DG256BCPV
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Obsolete
Core Processor HCS12 (CPU12) HCS12
Core Size 16-bit 16-bit
Maximum Clock Speed 25 MHz 25 MHz
Program Memory Size 256 KB (256K x 8) Flash 256 KB (256K x 8) Flash
RAM Size 12 KB 12 KB
EEPROM Size 4 KB 4 KB x 8
Kemasan 112-LQFP (20x20 mm) —
Jenis Pemasangan Surface Mount Surface Mount
Tegangan Pemberi Arus Operasi 2.5 V core / 5 V I/O (single 5 V supply with internal regulator) —
Suhu Operasi -40 C to +85 C [DATA_NEEDED: operating temperature range]
Number of I/O 91 91
ADC 2 x 8-channel 10-bit —
PWM Channels 8 —
Communication Interfaces CAN, I2C, SCI, SPI —
Connectivity CAN 2.0 A/B, I2C, SPI, 2x SCI CANbus, I2C, SCI, SPI
Peripherals PWM, WDT, POR, LVD, BDM debug PWM, WDT
Data Converters A/D 16x10b —
Oscillator Type Internal PLL + external crystal Internal
Aras MSL 3 (168 hours) —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Core Architecture — CISC
Program Memory Type — Flash
Tegangan Pemberi Arus — 2.5 V / 5 V
Kemasan / Case — 112-LQFP (20 x 20 mm)
Packaging — Tray

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