MC9S12E256MPVE vs MC9S12DG256MPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12E256MPVE disebabkan oleh NXP Semiconductors dan MC9S12DG256MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S12E256MPVE | MC9S12DG256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Core | HCS12 | — |
| Core Size | 16-bit | — |
| Maximum CPU Speed | 25 MHz | — |
| Program Memory | 256 KB Flash | — |
| RAM | 16 KB | 12 KB |
| Kemasan | 112-LQFP (20x20 mm) | 112-LQFP (20 x 20 mm) |
| Kiraan Pin | 112 | — |
| Tegangan Pemberi Arus | 5 V single rail (Vreg internal) | [DATA_NEEDED: Supply Voltage] |
| SCI Modules | 3 (asynchronous serial) | — |
| SPI Modules | 1 | — |
| IIC Modules | 1 (Inter-IC Bus) | — |
| Timer Modules | 3 x 16-bit, 4-channel | — |
| ADC | 8-channel, 10-bit | — |
| PWM Channels | 6 | — |
| Connectivity | EBI/EMI, I2C, SPI, SCI | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Core Processor | — | HCS12 |
| Core Architecture | — | 16-bit CISC |
| Frekuensi Klock Maksimum | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| EEPROM | — | 4 KB |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8 |
| GPIO Count | — | 91 |
| Number of I/O Banks / Ports | — | [DATA_NEEDED: Port Count] |
| Communication Interfaces | — | [DATA_NEEDED: Serial Interfaces (SCI/SPI/CAN)] |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) |
| Status RoHS | — | [DATA_NEEDED: RoHS Status] |