MC9S12XA512CAL vs MC9S12XDP512VAL Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XA512CAL disebabkan oleh NXP Semiconductors dan MC9S12XDP512VAL disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP
MC9S12XDP512VAL ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S12XA512CAL | MC9S12XDP512VAL |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS12X (enhanced HCS12, CISC) | — |
| Maximum CPU Frequency | 80 MHz | 80 MHz |
| Internal Bus Frequency | 40 MHz | — |
| Program Flash | 512 KB (512K x 8) | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Lebar Bus Data | 16-bit | — |
| ADC | 16-channel, 10-bit | 8/10-bit ATD (S12ATD10B8CV3) |
| General-Purpose I/O | Up to 91 | — |
| Communication Interfaces | CAN (MSCAN), SCI, SPI, IIC | — |
| Operating Voltage | 2.5 V / 5 V | — |
| Suhu Operasi | -40C to +85C (industrial) | [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade] |
| Kemasan | 112-LQFP (20x20 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Architecture | — | 16-bit CISC |
| Program Memory Size | — | 512 KB (512K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in KB] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM emulation size] |
| Tegangan Pemberi Arus | — | 2.35 V to 2.75 V |
| I/O Pins | — | 119 |
| Package Type | — | 112-pin LQFP (20 x 20 mm) |
| CAN Modules | — | Multiple MSCAN (CAN 2.0A/B) |
| Co-processor | — | XGATE |
| Instruction Set Compatibility | — | Upward-compatible with HCS12 |
| ROM Type | — | Flash |
| Status Lingkungan Hidup | — | Active |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |