MMA3202EG vs MMA2301EG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MMA3202EG disebabkan oleh NXP Semiconductors dan MMA2301EG disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MMA3202EG - ±112.5g/±56.3g Dual-Axis Analog Accelerometer | NXP
MMA3202EG ✓ Aktif
Pengandingan Spesifikasi
| Parametr | MMA3202EG | MMA2301EG |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Jenis Sensus | Accelerometer, Dual-Axis (X, Y) | Accelerometer, single-axis (X) |
| Sensing Technology | Capacitive MEMS | — |
| X-Axis Full-Scale Range | ±112.5 g | — |
| Y-Axis Full-Scale Range | ±56.3 g | — |
| X-Axis Sensitivity | 19 mV/g to 21 mV/g | — |
| Y-Axis Sensitivity | 38 mV/g to 42 mV/g | — |
| Bandwidth | 400 Hz (4-pole low-pass filter) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Jenis Output | Analog, ratiometric | Analog, ratiometric voltage |
| Tegangan Pemberi Arus | 5 V typical | 5.0 V typical (ratiometric output) |
| Gambaran Suhu Operasi | -40 °C to +125 °C | — |
| Kemasan | 20-pin SOIC wide-body (SOW) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Zero-g Offset | ≈ Vdd/2 (2.5 V nominal) | — |
| Self-Test Pin | Yes | — |
| g-Select Pin | Yes (dual sensitivity) | — |
| Temperature Compensation | On-chip | — |
| Filter Type | 4-pole low-pass Butterworth | 4-pole low-pass (Bessel-type), internal |
| Automotive Grade | AEC-Q100 qualified | — |
| Status RoHS | Compliant by Exemption | RoHS Compliant |
| Lead-Free Status | Lead Free | — |
| Gambaran UKUR | — | ±225 g (full scale); 200 g nominal |
| Axis | — | X (single axis) |
| Sensitivity | — | [DATA_NEEDED: sensitivity mV/g] |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Suhu Operasi | — | −40 °C to +125 °C (automotive) |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |
| Lead Free Status | — | Lead Free – Compliant by Exemption |