MMA3202EG vs MMA2301EG Karşılaştırma
Ayrıntılı yan yana karşılaştırma MMA3202EG tarafından NXP Semiconductors ve MMA2301EG tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MMA3202EG - ±112.5g/±56.3g Dual-Axis Analog Accelerometer | NXP
MMA3202EG ✓ Aktif
Özellik Karşılaştırması
| Parametre | MMA3202EG | MMA2301EG |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Yaşam Döngüsü Durumu | Aktif | Obsolete |
| Duyarlılık Türü | Accelerometer, Dual-Axis (X, Y) | Accelerometer, single-axis (X) |
| Sensing Technology | Capacitive MEMS | — |
| X-Axis Full-Scale Range | ±112.5 g | — |
| Y-Axis Full-Scale Range | ±56.3 g | — |
| X-Axis Sensitivity | 19 mV/g to 21 mV/g | — |
| Y-Axis Sensitivity | 38 mV/g to 42 mV/g | — |
| Bandwidth | 400 Hz (4-pole low-pass filter) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Çıkış Türü | Analog, ratiometric | Analog, ratiometric voltage |
| Besleme Gerilimi | 5 V typical | 5.0 V typical (ratiometric output) |
| İşletim Sıcaklığı Aralığı | -40 °C to +125 °C | — |
| Paket | 20-pin SOIC wide-body (SOW) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Montaj Türü | Surface Mount | Surface Mount |
| Zero-g Offset | ≈ Vdd/2 (2.5 V nominal) | — |
| Self-Test Pin | Yes | — |
| g-Select Pin | Yes (dual sensitivity) | — |
| Temperature Compensation | On-chip | — |
| Filter Type | 4-pole low-pass Butterworth | 4-pole low-pass (Bessel-type), internal |
| Automotive Grade | AEC-Q100 qualified | — |
| RoHS Durumu | Compliant by Exemption | RoHS Compliant |
| Lead-Free Status | Lead Free | — |
| ölçümler Aralığı | — | ±225 g (full scale); 200 g nominal |
| Axis | — | X (single axis) |
| Sensitivity | — | [DATA_NEEDED: sensitivity mV/g] |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| İşletim Sıcaklığı | — | −40 °C to +125 °C (automotive) |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |
| Lead Free Status | — | Lead Free – Compliant by Exemption |