MPC8245LZU350D vs MPC8245LZU300D Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8245LZU350D disebabkan oleh NXP Semiconductors dan MPC8245LZU300D disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
MPC8245LZU300D NrndPengandingan Spesifikasi
| Parametr | MPC8245LZU350D | MPC8245LZU300D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | — |
| Series | MPC82xx | — |
| Core Processor | PowerPC 603e | — |
| Core Architecture | Power Architecture (32-bit) | PowerPC 603e (Power Architecture technology) |
| Number of Cores | 1 | 1 |
| Lebar Bus Data | 32 bit | — |
| Frekuensi Klock Maksimum | 350 MHz | — |
| Performance | 665 MIPS | 570 MIPS |
| Operating Voltage (Core/I/O) | 3.3 V | — |
| Process Technology | 0.25 um CMOS | — |
| Integrated Bridge | PCI Bridge (up to 66 MHz) | — |
| L1 Cache (I/D) | 16 KB / 16 KB | — |
| Memory Controller | SDRAM with ECC support | SDRAM, up to 2 GB, up to 133 MHz |
| Suhu Operasi | 0C to +105C | 0C to +105C |
| Kemasan | 352-TBGA (35x35 mm) | 352-TBGA (35x35 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Non-Compliant (legacy) | [DATA_NEEDED: RoHS compliance status] |
| Processor Type | — | MPC82xx PowerQUICC II Integrated Host Processor |
| Core Frequency | — | 300 MHz |
| Core Supply Voltage | — | 1.8 V |
| Bus Width | — | 32-bit |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| PCI Interface | — | 32-bit, up to 66 MHz |
| Lead Status | — | Contains Lead |
| Packaging | — | Tray |