MPC8270CZQMIBA vs MPC8250AVVPIBC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8270CZQMIBA disebabkan oleh NXP Semiconductors dan MPC8250AVVPIBC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8270CZQMIBA - PowerQUICC II MPU, 266MHz, BGA-516 | NXP
MPC8270CZQMIBA ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC8250AVVPIBC - PowerQUICC II 300MHz MPU | NXP 480-TBGA
MPC8250AVVPIBC ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC8270CZQMIBA | MPC8250AVVPIBC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Architecture | PowerPC G2_LE (PowerQUICC II) | — |
| Core Count | 1 | — |
| Lebar Bus Data | 64-bit | 32-Bit |
| Core Clock Speed | 266 MHz (family up to 333 MHz) | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | — |
| Suhu Operasi | -40 C to +105 C | 0C to +105C |
| Package Type | PBGA, 27 x 27 mm, 2.25 mm height, 1.0 mm pitch | — |
| Kiraan Pin | 516 | 480 |
| Process Technology | HiPerMOS7 0.13-micron CMOS | 0.25 um CMOS |
| Integrated Peripherals | PCI, USB, HDLC (128 ch), 10/100 Ethernet, UART | — |
| Memory Controller | Integrated SDRAM, Flash, ROM support | SDRAM / Flash / ROM |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes (per datasheet) | — |
| Status RoHS | Compliant | Non-Compliant (NO-PB marking) |
| Core Architecture | — | PowerPC G2 |
| Number of Cores | — | 1 |
| Core Frequency | — | 300 MHz |
| Series | — | MPC82xx (PowerQUICC II) |
| Tegangan Pemberi Arus | — | 3.3 V |
| Kemasan | — | 480-TBGA (37.5 x 37.5 mm) |
| Communications Processor Module | — | Integrated CPM |
| External Bus Speed | — | Up to 133 MHz |