MPC8271ZQMIBA vs MPC8271VRTIEA Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8271ZQMIBA disebabkan oleh NXP Semiconductors dan MPC8271VRTIEA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC8271ZQMIBA MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA ✓ Aktif
NXP Semiconductors
MPC8271VRTIEA MPC8271VRTIEA - 400MHz PowerQUICC II MPU, 516-PBGA | NXP

MPC8271VRTIEA - 400MHz PowerQUICC II MPU, 516-PBGA | NXP

MPC8271VRTIEA ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr MPC8271ZQMIBA MPC8271VRTIEA
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Akhir Hidup
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Processor Type MPC82xx PowerQUICC II, PowerPC G2_LE MPC82xx PowerQUICC II 32-bit
Core Architecture 32-bit Power Architecture (PowerPC) PowerPC G2_LE
Core Count 1 (plus CPM RISC engine) —
Frekuensi Klock Maksimum 266 MHz —
Core Voltage 1.5 V 1.5 V
I/O Voltage 3.3 V 3.3 V
L1 Instruction Cache 16 KB 16 KB
L1 Data Cache 16 KB 16 KB
External Memory Bus 32-bit 60x bus —
Kemasan 516-BBGA (TEBGA2), 27x27 mm —
Process Technology 0.13 um HiP7 CMOS —
Ethernet MACs 2 x 10/100 Mbit/s —
Serial Communication Controllers 2 (Fast / H.110-style SCC) —
PCI Interface 32-bit PCI 2.3 —
USB / I2C / SPI USB 1.1, I2C, SPI —
Lead Free Status Contains Lead (SnPb ball variant) —
Status RoHS Non-Compliant (Pb-bearing PBGA) Compliant (Lead-Free)
Suhu Operasi [DATA_NEEDED: Operating Temperature grade] 0°C to +105°C
Aras MSL [DATA_NEEDED: MSL rating] —
Number of Cores — 1
Core Clock Speed — 400 MHz
Performance — 760 MIPS
Kemasan / Case — 516-PBGA (27x27 mm)
Integrated Interfaces — PCI, USB, Fast Ethernet, UTOPIA, HDLC
Memory Controller — DDR SDRAM, 60x bus, Local bus
Security Engine — IPSec, 3DES, AES, SHA-1, MD5
Packaging — Tray
Technology — 0.13 µm HiP7 CMOS

Laporan Datasheet & Sumber

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