MPC8306SVMABDCA vs MPC8306SCVMABDCA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8306SVMABDCA disebabkan oleh NXP Semiconductors dan MPC8306SCVMABDCA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
MPC8306SCVMABDCA ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC8306SVMABDCA | MPC8306SCVMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Core Architecture | PowerPC e300c3 (Power Architecture) | — |
| Core Count | 1 | — |
| Lebar Bus Data | 32-bit | 32 bit |
| Core Frequency | 133 MHz | — |
| Memory Controller | DDR2 up to 333 MHz data rate | DDR2 |
| On-chip Cache | 32 KB instruction / 32 KB data | — |
| Ethernet | Dual 10/100 MAC with MII/RMII | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Connectivity | QUICC Engine (HDLC, TDM), 2x UART | — |
| Kemasan | 369-MAPBGA (19x19 mm, 0.8 mm pitch) | 369-PBGA MAP-BGA (19x19 mm) |
| Suhu Operasi | 0C to +105C | -40C to +105C (extended) |
| Tegangan Pemberi Arus | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Lead-Free | Yes | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Core | — | PowerPC e300c3 |
| Architecture | — | Power Architecture, 32-bit |
| Maximum Core Frequency | — | 133 MHz |
| Number of Cores | — | 1 |
| Jenis Pemasangan | — | Surface Mount |
| Local Bus | — | 16-bit |
| Communications Engine | — | QUICC Engine (HDLC, TDM) |
| Time Synchronization | — | IEEE 1588 v2 |