MPC8313EVRAGDC vs MPC8313ECZQAFFC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8313EVRAGDC disebabkan oleh NXP Semiconductors dan MPC8313ECZQAFFC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8313EVRAGDC - PowerQUICC II Pro SoC 400MHz | NXP
MPC8313EVRAGDC ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | MPC8313EVRAGDC | MPC8313ECZQAFFC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Processor Family | PowerQUICC II Pro (MPC83xx) | — |
| Core Architecture | 32-bit e300 RISC | — |
| Maximum CPU Frequency | 400 MHz | — |
| Core Voltage | 0.95 V to 1.05 V | 0.95 V to 1.05 V |
| I/O Voltage | 2.5 V / 3.3 V | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2, up to 256 MB |
| Ethernet | 2x 10/100/1000 Mbps (GMII/TBI/RGMII) | 2x 10/100/1000 MAC (Gigabit) |
| USB | USB 2.0 host/device/OTG | USB 2.0 High-Speed (Host/Device) |
| PCI Controller | 32-bit / 66 MHz PCI | — |
| Security Engine | SEC 3.x (DES/3DES/AES/SHA/RSA) | SEC (DES/3DES/AES/MD5/SHA-1) |
| Kemasan | 516-Ball TEBGA (Tape Enhanced BGA) | 516-TEPBGA (27x27 mm) |
| Suhu Operasi | 0 C to +105 C | -40C to +105C |
| Process Technology | 90 nm CMOS | — |
| Status RoHS | Compliant (per NXP product page) | Compliant |
| Processor Type | — | PowerPC e300c3 |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Count | — | 1 |
| Bit Width | — | 32-Bit |
| Clock Speed | — | 333 MHz |
| Jenis Pemasangan | — | Surface Mount |
| L1 Cache | — | 16 KB I-Cache, 16 KB D-Cache |
| PCI | — | PCI 2.3 |