MPC8313EVRAGDC vs MPC8313ECZQAFFC 对比
详细并排对比 MPC8313EVRAGDC 出自 NXP Semiconductors 和 MPC8313ECZQAFFC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC8313EVRAGDC | MPC8313ECZQAFFC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $31.50 | $21.30 |
| Processor Family | PowerQUICC II Pro (MPC83xx) | — |
| Core Architecture | 32-bit e300 RISC | — |
| Maximum CPU Frequency | 400 MHz | — |
| Core Voltage | 0.95 V to 1.05 V | 0.95 V to 1.05 V |
| I/O Voltage | 2.5 V / 3.3 V | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | DDR1 / DDR2 with ECC | DDR1/DDR2, up to 256 MB |
| Ethernet | 2x 10/100/1000 Mbps (GMII/TBI/RGMII) | 2x 10/100/1000 MAC (Gigabit) |
| USB | USB 2.0 host/device/OTG | USB 2.0 High-Speed (Host/Device) |
| PCI Controller | 32-bit / 66 MHz PCI | — |
| Security Engine | SEC 3.x (DES/3DES/AES/SHA/RSA) | SEC (DES/3DES/AES/MD5/SHA-1) |
| 封装 | 516-Ball TEBGA (Tape Enhanced BGA) | 516-TEPBGA (27x27 mm) |
| 工作温度 | 0 C to +105 C | -40C to +105C |
| Process Technology | 90 nm CMOS | — |
| RoHS 状态 | Compliant (per NXP product page) | Compliant |
| Processor Type | — | PowerPC e300c3 |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Count | — | 1 |
| Bit Width | — | 32-Bit |
| Clock Speed | — | 333 MHz |
| 安装类型 | — | Surface Mount |
| L1 Cache | — | 16 KB I-Cache, 16 KB D-Cache |
| PCI | — | PCI 2.3 |