MPC860DPZQ66D4 vs MPC862PZQ66B Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860DPZQ66D4 disebabkan oleh NXP Semiconductors dan MPC862PZQ66B disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPC860DPZQ66D4 ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoletePengandingan Spesifikasi
| Parametr | MPC860DPZQ66D4 | MPC862PZQ66B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | MPC8xx PowerQUICC 32-Bit MPU |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| Kemasan / Case | 357-Ball PBGA, 25 x 25 mm | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Lead-Free Status | Contains Lead | — |
| Status RoHS | Non-RoHS (legacy BGA, contains lead) | Non-compliant per third-party listing (Contains Pb) |
| Suhu Operasi | 0C to +70C (commercial grade) | — |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Number of Cores | — | 1 |
| Core Architecture | — | PowerPC + CPM (QUICC) |
| Lebar Bus Data | — | 32-bit |
| Maximum Clock Speed | — | 66 MHz |
| Tegangan Pemberi Arus Operasi | — | 3.3 V |
| Jenis Pemasangan | — | Surface Mount |
| Lead Free Status | — | Contains Lead |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA (PBGA) |
| Series | — | MPC8xx PowerQUICC |
| Temperature Grade | — | Other (per data sheet) |